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Honor Magic9

Honor Magic9 is a high-end flagship phone series launched by Honor, which was released in Beijing on September 28, 2026. It is Honor's first model to apply TSMC's 2nm N2P process technology in high-end flagship models.  

This series includes three models: Standard Edition, Pro Edition, and Pro Max Edition. Among them, Pro Max is the first model added to the series, positioned as the annual flagship straight board and undertaking the product iteration of Magic8 series.  

The screen adopts a 2.5D straight screen design, with the standard version measuring 6.36 inches and the Pro and Pro Max versions measuring 6.85 inches. The first batch of the entire series is equipped with Qualcomm Snapdragon 8 Elite Gen6 chip, with a super large core CPU frequency exceeding 5GHz and a 2+3+3 triple cluster architecture design.

This series is equipped with a 55 megapixel "Dynamic Eye" front camera, and the first Android front square field of view. The new generation of Qinghai Lake blade batteries with a capacity of 11000mAh will be launched in this series.  

Pre installed MagicOS and will release the "pure blood" AgenticOS; YOYO intelligent agent has been upgraded to an active intelligent agent that can understand user intentions and automatically execute complex long instructions across applications, enhancing the end-to-end AI experience.

The series will also be equipped with Alibaba Qwen Intelligence and introduce the industry's first system level Agent Harness. Based on this scheme, the comprehensive task accuracy reached 91.8%, the average time for automatic execution was 3.6 seconds, the maximum number of operable steps exceeded 100, and the end-to-end task closure rate reached 90%.  

Jointly developed an imaging system with ARRI in Germany, supporting ARRI LogC3 curves, ARRI Look, and ARRI movie modes; Plan a dual 200 million pixel solution and return to LOFIC technology to enhance the dynamic range and color performance of backlit and night scenes. This series is the industry's first release of CIPA8.0 anti shake.

Its main parameters are as follows:

3.5mm jack No
Announced 2026, September 28
Bluetooth 6.0, A2DP, LE, aptX HD, aptX Adaptive, aptX Lossless, LHDC 5, Auracast, ASHA
Build Glass front, aluminum frame, glass back
Card slot No
Charging 80W wired
50W wireless
27W reverse wired
Reverse wireless
Chipset Qualcomm SM8850-AC Snapdragon 8 Elite Gen 5 (3 nm)
Colors Black, White, Green, Yellow
CPU Octa-core (2x4.6 GHz Oryon V3 Phoenix L + 6x3.62 GHz Oryon V3 Phoenix M)
Dimensions 151 x 72.3 x 8.5 mm (5.94 x 2.85 x 0.33 in)
Features Color spectrum sensor, Multi-focus LED flash, HDR, panorama, ARRI mode
HDR
GPU Adreno 840
Infrared port Yes
Internal 256GB 12GB RAM, 512GB 12GB RAM, 512GB 16GB RAM, 1TB 16GB RAM
Loudspeaker Yes, with stereo speakers
Models MLY-AN00
NFC Yes
OS Android 17, MagicOS 11
Positioning GPS (L1+L5), BDS (B1I+B1c+B2a+B2b), GALILEO (E1+E5a+E5b), QZSS (L1+L5), NavIC (L1+L5), GLONASS
Radio No
Resolution 1236 x 2664 pixels, 19.5:9 ratio (~461 ppi density)
HDR image support
* Measured at an isolated spot during video playback only
Sensors Fingerprint (under display, ultrasonic), accelerometer, gyro, proximity, compass
SIM Nano-SIM + Nano-SIM
IP68/IP69K dust tight and water resistant (high pressure water jets; immersible up to 1.5m for 30 min)
Single 55 MP multi-aspect, f/2.0, 21mm (wide), 1/2.74"
Size 6.37 inches, 99.9 cm2 (~91.5% screen-to-body ratio)
Status Coming soon. Exp. release 2026, October 08
Technology GSM / HSPA / LTE / 5G
Triple 200 MP, f/1.9, (wide), 1/1.4", PDAF, OIS
200 MP, f/2.6, (periscope telephoto), 1/1.56", PDAF, OIS, 3.5x optical zoom
50 MP, f/2.0, (ultrawide), PDAF
Type OLED, 1B colors, 120Hz, 3840Hz PWM, Dolby Vision, HDR Vivid, 2000 nits (HBM), 10000 nits (peak)*
Si/C Li-Po 8000 mAh
USB USB Type-C 2.0, OTG
Video 4K@30/60/120fps, 1080p@30/60fps, gyro-EIS, OIS, HDR, 10-bit video, ARRI LogC3 Curve & LUT
4K@30/60fps, 1080p@30/60fps, gyro-EIS
Weight 209 g (7.37 oz)
WLAN Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band, Wi-Fi Direct

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